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產(chǎn)品介紹

基本參數(shù): SPTU240R2 ABB DCS電源控制器

模塊電源(BMP)因其高效、安全、可靠、系統(tǒng)升級(jí)容易等特點(diǎn)，廣泛的應(yīng)用于工業(yè)自動(dòng)化、繼電保護(hù)、配網(wǎng)自動(dòng)化、軌道交通、汽車(chē)電子、航空航天等高可靠性高性能的領(lǐng)域。正確合理地選用DC/DC模塊電源，可以省卻電源設(shè)計(jì)、調(diào)試方面的麻煩，將主要精力集中在自己專(zhuān)業(yè)的領(lǐng)域，這樣不僅可以提高整體系統(tǒng)的可靠性和設(shè)計(jì)水平，而且更重要的是縮短了整個(gè)產(chǎn)品的研發(fā)周期。

[模塊電源技術(shù)發(fā)展趨勢(shì)]

為滿(mǎn)足市場(chǎng)對(duì)電源性能不斷提高的要求，DC/DC模塊電源一直向高效率、高功率密度、高頻化、數(shù)字化、寬輸入電壓范圍、低壓大電流、低噪聲.小型化、高可靠性、小型化和標(biāo)準(zhǔn)化的方向發(fā)展

自1996年朗訊，(Lucent)推出半磚電源模塊，模塊電源在近20年得到了高速的發(fā)展，筆者從2003年開(kāi)始從事模塊電源的工作，目睹了模塊電源的高速發(fā)展過(guò)程，以1/4磚通信用模塊電源為例，從筆者第一次2003年接開(kāi)模塊電源開(kāi)發(fā)，1/4磚模塊的效率為87%，功率為60W，到2020年，1/4磚模塊電源的效率達(dá)到效率98%，功率達(dá)到1200W。效率提升了11%，功率密度提升20倍.

高效率:隨著半導(dǎo)體技術(shù)、工藝的發(fā)展，低導(dǎo)通阻抗、低開(kāi)關(guān)損耗的新型功率器件不斷涌現(xiàn)，以及軟開(kāi)關(guān)技術(shù)的成熟和應(yīng)用，促進(jìn)了模塊電源的效率的進(jìn)一步提高;

高功率密度、小型化:隨著平面變壓器、平面電感技術(shù)、多層厚PCB工藝和技術(shù)、和寬禁帶半導(dǎo)體材料GaN)的發(fā)展與成熟，促進(jìn)了模塊電源的高頻化、小型化發(fā)展。尤其是GaN功率器件的發(fā)展，因其良好的高頻開(kāi)關(guān)和低損耗的優(yōu)點(diǎn)，將進(jìn)一步顯著的推動(dòng)模塊電源功率密度和小型化，同時(shí)，得益于有源器件的集成化，磁集成、埋阻、埋容等無(wú)源器件的集成技術(shù)，3D集成封裝技術(shù)及散熱技術(shù)的發(fā)展，模塊電源的高功率密度和小型化將進(jìn)一步持續(xù)發(fā)展;

智能化:隨著數(shù)字電源管理芯片的成款和發(fā)展，推動(dòng)了模塊電源的數(shù)字化發(fā)展，數(shù)字控制電源因其靈活的控制方式、結(jié)構(gòu)化模塊化設(shè)計(jì)，精確的精度控制和調(diào)節(jié)，出色的動(dòng)態(tài)響應(yīng)性能及強(qiáng)大的故喧響應(yīng)和偵測(cè)等特點(diǎn)，模塊電源的數(shù)字化控制和智能化通信監(jiān)控將是必然的趨勢(shì)。特別是在中高功率的模塊電源和動(dòng)態(tài)中間母線供電架構(gòu)系統(tǒng)中將會(huì)得到廣泛的應(yīng)用;

高可靠性:目前市場(chǎng)上的模塊電源主要應(yīng)用在通訊、電力、軌道交通、航空航天及軍工等領(lǐng)域，相關(guān)領(lǐng)域?qū)δK電源的可靠性和穩(wěn)定性提出了極高的要求，隨著有源和無(wú)源器件的集成度提高，數(shù)字控制芯片的成熟，減少了模塊電源的器件數(shù)量，同時(shí)隨著效率的提升和散熱技術(shù)的發(fā)展，以及模塊電源生產(chǎn)和組裝工藝的進(jìn)步，將大大促進(jìn)了模塊電源的可靠性提升。

Product introduction

Basic parameters: SPTU240R2 ABB DCS power controller

Due to its high efficiency, safety, reliability and easy system upgrade, BMP is widely used in industrial automation, relay protection, distribution network automation, rail transit, automotive electronics, aerospace and other high reliability and high performance fields. The correct and reasonable selection of DC/DC module power supply can save the trouble of power supply design and debugging, and focus on their own professional fields, which can not only improve the reliability and design level of the overall system, but more importantly, shorten the development cycle of the entire product.

[Module power supply technology development trend]

In order to meet the market requirements for the continuous improvement of power performance, DC/DC module power supplies have been to high efficiency, high power density, high frequency, digital, wide input voltage range, low voltage and high current, low noise. The direction of miniaturization, high reliability, miniaturization and standardization

Since 1996, Lucent launched the half brick power module, the module power supply in nearly 20 years has been rapid development, the author began to engage in the module power supply work from 2003, witnessed the rapid development process of the module power supply, taking the 1/4 brick communication module power supply as an example, from the first time the author opened the module power supply development in 2003. The 1/4 brick module has an efficiency of 87% and a power of 60W, and by 2020, the efficiency of the 1/4 brick module power supply will reach 98% efficiency and 1200W power. Improved efficiency by 11% and power density by 20 times.

High efficiency: With the development of semiconductor technology and process, new power devices with low on-impedance and low switching loss continue to emerge, as well as the maturity and application of soft switching technology, which promotes the further improvement of the efficiency of module power supplies;

High power density and miniaturization: With the development and maturity of planar transformers, planar inductance technology, multi-layer thick PCB process and technology, and wide band gap semiconductor material GaN, the development of high-frequency and miniaturization of module power supplies has been promoted. Especially the development of GaN power devices, because of its good high-frequency switching and low loss advantages, will further significantly promote the power density and miniaturization of module power supplies, at the same time, thanks to the integration of active devices, magnetic integration, buried resistance, buried capacity and other passive device integration technology, 3D integrated packaging technology and heat dissipation technology development, The high power density and miniaturization of module power supplies will continue to develop;

Intelligent: With the development and development of digital power management chips, the digital control power supply has promoted the digital development of module power supply, because of its flexible control mode, structured modular design, accurate precision control and adjustment, excellent dynamic response performance and strong noise response and detection characteristics. The digital control and intelligent communication monitoring of module power supply will be an inevitable trend. Especially in the medium and high power module power supply and dynamic intermediate bus power supply architecture system will be widely used;

High reliability: The module power supply on the market is mainly used in the fields of communication, power, rail transit, aerospace and military industry, etc. The reliability and stability of the module power supply are put forward extremely high requirements in related fields. With the improvement of the integration of active and passive devices and the maturity of digital control chips, the number of module power supply devices is reduced. At the same time, with the improvement of efficiency and the development of heat dissipation technology, as well as the progress of the module power supply production and assembly process, the reliability of the module power supply will be greatly promoted.

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