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Xycom XVME-976 是一款 VME 總線轉(zhuǎn)接模塊，主要用于擴(kuò)展 VMEbus 系統(tǒng)的功能，支持連接 PC/104 和 PMC（PCI Mezzanine Card）擴(kuò)展模塊，適用于工業(yè)自動(dòng)化、測(cè)試測(cè)量等領(lǐng)域。

核心功能

1. 擴(kuò)展模塊支持
   • PC/104 擴(kuò)展：提供 1 或 2 個(gè) PC/104 擴(kuò)展站點(diǎn)，兼容標(biāo)準(zhǔn) PC/104 模塊（如以太網(wǎng)、SCSI、串行、并行等），支持 A 型（帶前面板）和 B 型（通用型）模塊。
   • PMC 擴(kuò)展：提供 1 或 2 個(gè) PMC 站點(diǎn)，支持 IEEE P1386 標(biāo)準(zhǔn)，允許擴(kuò)展 PCI 功能（如高速數(shù)據(jù)采集、通信接口等）。
   • 可選模塊：支持 ATM、FDDI、SCSI 等擴(kuò)展（需第三方模塊）。
2. 電氣特性
   • 電源管理：板載直流穩(wěn)壓器，為 PMC 站點(diǎn)提供 3.3V 電壓。
   • 信號(hào)緩沖：PC/104 信號(hào)（除數(shù)據(jù)線外）均經(jīng)過(guò)緩沖，確保信號(hào)完整性。
   • 跳線配置：用戶可通過(guò)跳線自定義信號(hào)路由，適應(yīng)不同擴(kuò)展需求。
3. 機(jī)械設(shè)計(jì)
   • 6U VME 插槽：符合標(biāo)準(zhǔn) VMEbus 卡籠尺寸，支持熱插拔。

   • 插針連接器：采用高可靠性插針和插座方案，適應(yīng)工業(yè)環(huán)境振動(dòng)和沖擊。

   • 

技術(shù)參數(shù)

• 環(huán)境適應(yīng)性：
  • 工作溫度：0°C 至 50°C（32°F 至 122°F）
  • 存儲(chǔ)溫度：-40°C 至 60°C（-40°F 至 140°F）
  • 濕度：20% 至 80% RH（非凝結(jié)）
  • 振動(dòng)：5Hz 至 2000Hz，0.15mm 峰峰值位移
  • 沖擊：30g 峰值加速度（11ms 持續(xù)時(shí)間）
• 兼容性：
  • 支持 Xycom VME 處理器模塊（如 XVME-653、XVME-654、XVME-655）。
  • PMC 站點(diǎn)兼容 2.0 規(guī)范（IEEE P1386）。

  • PC/104 站點(diǎn)符合 ISA 標(biāo)準(zhǔn)。

  • 

典型應(yīng)用場(chǎng)景

1. 工業(yè)自動(dòng)化
   • 作為 VMEbus 系統(tǒng)的 I/O 擴(kuò)展樞紐，連接 PC/104 模塊實(shí)現(xiàn)以太網(wǎng)通信、數(shù)據(jù)存儲(chǔ)或傳感器接口。
   • 通過(guò) PMC 模塊擴(kuò)展高速 ADC/DAC，用于實(shí)時(shí)控制或信號(hào)處理。
2. 測(cè)試與測(cè)量
   • 在數(shù)據(jù)采集系統(tǒng)中，集成 PC/104 模塊實(shí)現(xiàn)多通道同步采樣，或通過(guò) PMC 模塊擴(kuò)展高速緩存。
   • 支持 SCSI 接口連接外部存儲(chǔ)設(shè)備，滿足大數(shù)據(jù)記錄需求。

3. 軍事與航空航天

   • 模塊化設(shè)計(jì)便于系統(tǒng)升級(jí)，適應(yīng)高可靠性要求的嵌入式應(yīng)用。

   • 支持冗余配置，提高系統(tǒng)容錯(cuò)能力。

   
   

Xycom XVME-976 is a VME bus adapter module mainly used to expand the functionality of VMEbus systems. It supports connecting PC/104 and PMC (PCI Mezzanine Card) expansion modules and is suitable for industrial automation, testing and measurement, and other fields.

core functionality

Extension module support

PC/104 Expansion: Provides 1 or 2 PC/104 expansion sites, compatible with standard PC/104 modules such as Ethernet, SCSI, serial, parallel, etc., supporting A-type (with front panel) and B-type (universal) modules.

PMC Expansion: Provides 1 or 2 PMC sites, supports IEEE P1386 standard, and allows for the expansion of PCI functionality (such as high-speed data acquisition, communication interfaces, etc.).

Optional modules: Supports ATM, FDDI, SCSI and other extensions (requires third-party modules).

Electrical Characteristics

Power management: Onboard DC regulator provides 3.3V voltage to PMC sites.

Signal buffering: All PC/104 signals (except for data lines) are buffered to ensure signal integrity.

Jumper configuration: Users can customize signal routing through jumpers to meet different expansion needs.

Mechanical Design

6U VME slot: conforms to the standard VMEbus card cage size and supports hot swapping.

Pin connector: Adopting high reliability pin and socket solutions, suitable for industrial environment vibration and impact.

Technical Specifications

Environmental adaptability:

Working temperature: 0 ° C to 50 ° C (32 ° F to 122 ° F)

Storage temperature: -40 ° C to 60 ° C (-40 ° F to 140 ° F)

Humidity: 20% to 80% RH (non condensing)

Vibration: 5Hz to 2000Hz, 0.15mm peak to peak displacement

Impact: 30g peak acceleration (11ms duration)

Compatibility:

Support Xycom VME processor modules (such as XVME-653, XVME-654, XVME-655).

PMC site is compatible with the 2.0 specification (IEEE P1386).

The PC/104 site complies with ISA standards.

Typical application scenarios

Industrial Automation

As the I/O expansion hub of the VMEbus system, it connects PC/104 modules to achieve Ethernet communication, data storage, or sensor interfaces.

Expand high-speed ADC/DAC through PMC module for real-time control or signal processing.

test and measurement

In the data acquisition system, the PC/104 module is integrated to achieve multi-channel synchronous sampling, or the PMC module is used to expand the high-speed cache.

Support SCSI interface connection to external storage devices to meet the needs of big data recording.

Military and Aerospace

Modular design facilitates system upgrades and adapts to embedded applications with high reliability requirements.

Support redundant configuration to improve system fault tolerance.