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廈門雄霸 > 挑產(chǎn)品 > MOTOROLA/摩托羅拉/主板

MOTOROLA/摩托羅拉/主板

MVME177-003 MOTOROLA 單板計(jì)算機(jī) 實(shí)現(xiàn)RISC性能水平

品牌：MOTOROLA

型號(hào)：MVME177-003

訂貨號(hào)：MVME177-003

上架日期：2023-07-31 14:02

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產(chǎn)品詳情

MVME177-003 MOTOROLA 單板計(jì)算機(jī) 實(shí)現(xiàn)RISC性能水平

摩托羅拉MME177VMEmodule經(jīng)過(guò)指定、設(shè)計(jì)和測(cè)試，可在0至55C(32至131*F)的進(jìn)風(fēng)溫度范圍內(nèi)可靠運(yùn)行，并采用100CFM軸流風(fēng)扇以通常可實(shí)現(xiàn)的速度強(qiáng)制空氣冷卻。溫度鑒定在標(biāo)準(zhǔn)的摩托羅拉vmessystem底盤中進(jìn)行。25瓦負(fù)載板插入兩個(gè)卡槽，每則一個(gè)，靠近被測(cè)板，以模擬高功率密度系統(tǒng)配置。一個(gè)由三個(gè)軸流風(fēng)扇組成的組件，每個(gè)風(fēng)扇額定功率為100 CFM，直接放置在VME卡籠下方。在風(fēng)扇組件和卡籠之間測(cè)量進(jìn)風(fēng)溫度，進(jìn)風(fēng)氣流首先遇到被測(cè)模塊。當(dāng)模塊受到環(huán)境溫度變化的影響時(shí)，執(zhí)行測(cè)試軟件。監(jiān)控關(guān)鍵的高功率密度集成電路的溫度，以確保不超過(guò)組件供應(yīng)商的規(guī)格。

而冷卻所需的確切氣流量取決于:【環(huán)境空氣溫度】

【板的類型】【板數(shù)】

【電路板位置】【其他熱源】

通常在10CFM和490 LFM流過(guò)模塊時(shí)可以達(dá)到足夠的冷卻。在最大環(huán)境溫度較低的環(huán)境中，冷卻模塊所需的氣流較少。在更有利的熱條件下，隨著氣流的增加，模塊可以在高于55'C的溫度下可靠地運(yùn)行。值得注意的是，除了氣動(dòng)器的額定CFM外，還有幾個(gè)因素決定了流過(guò)模塊的空氣的實(shí)際體積和速度。

Atlas主板需要強(qiáng)制空氣冷卻。安裝MPC6O4 RISC處理器需要額外的冷卻。主板上提供了一個(gè)3針頭(J17)，用于為專用風(fēng)扇供電。參考“一般信息"章節(jié)中的“莆散熱要求”小節(jié)，了解系統(tǒng)板平臺(tái)的溫度認(rèn)證信息。

The MOTOROLA MME177VMEmodule is specified, designed and tested to operate reliably over an inlet air temperature range of 0 to 55C(32 to 131*F) and uses a 100CFM axial flow fan to force air cooling at speeds normally achievable. The temperature evaluation was performed on a standard MOTOROLA vmessystem chassis. The 25-watt load board is inserted into two card slots, one each, close to the board under test to simulate a high power density system configuration. An assembly consisting of three axial flow fans, each rated at 100 CFM, is placed directly under the VME card cage. The inlet air temperature is measured between the fan assembly and the cage, and the inlet air flow first encounters the module under test. When the module is affected by changes in ambient temperature, the test software is executed. Monitor the temperature of critical high power density integrated circuits to ensure they do not exceed component supplier specifications.

The exact air flow required for cooling depends on: [ambient air temperature]

【 Type of board 】【 Number of board 】

【 Circuit board location 】【 Other heat source 】

Adequate cooling is usually achieved at 10CFM and 490 LFM flowing through the module. In an environment with a lower maximum ambient temperature, less airflow is required to cool the module. In more favorable thermal conditions, with increased airflow, the module can operate reliably at temperatures above 55'C. It is worth noting that in addition to the rated CFM of the pneumatic, there are several factors that determine the actual volume and speed of the air flowing through the module.

Atlas motherboards require forced air cooling. Installing the MPC6O4 RISC processor requires additional cooling. A 3-pin (J17) is provided on the motherboard to power the dedicated fan. Refer to the "Heat Dissipation Requirements" section of the "General Information" section for temperature certification information for the system board platform.

現(xiàn)貨產(chǎn)品：MVME177-003 MOTOROLA 單板計(jì)算機(jī) 實(shí)現(xiàn)RISC性能水平

我公司的優(yōu)勢(shì)品牌和系列如下:

【霍尼韋爾】模塊DCS/PLC

【艾默生/臺(tái)達(dá)V】模塊

【ABB】輸入輸出模塊

(AB】模組/觸摸屏

【GE/發(fā)那科】IC69系列可編程控制器

【本特利內(nèi)華達(dá)】3500系統(tǒng)

【橫河電機(jī)】壓力變送器

【安川】伺服驅(qū)動(dòng)器/伺服電機(jī)

如果您需要詳細(xì)的技術(shù)信息，歡迎與我們聯(lián)系。

選擇我們的理由：MVME177-003 MOTOROLA 單板計(jì)算機(jī) 實(shí)現(xiàn)RISC性能水平